ThermalTake launches a special AMD Leo edition of the Armor A60, this case features a red and black design and has a small side window. NewEgg is selling the case for $109.99.

Thermaltake, leading DIY chassis brand, is launching the world’s first SideClick EasySwap HDD docking mid-tower with integrated USB 3.0 SuperSpeed connector particularly designed for AMD Leo gaming PCs, the ARMOR A60 AMD Leo Edition. Thermaltake lined up with AMD to design a computer chassis particularly catering to the latest AMD Leo gaming platform. It shows the typical bullet-proof armory contours of this series while the front panel has gotten an even fiercer AMD-red color ornamentation, with the left side panel sporting an AMD Leo tattoo. The otherwise entirely black design with metal mesh elements lend the ARMOR series an extremely stylish and powerful appearance that attracts gamers and enthusiasts alike. The top and front red LED-fans enhance the overall combat ambience, resembling the typical MMORPG ambience but also providing ideal cooling characteristics for the AMD Leo platform . A special lock mechanism for your mouse and keyboard ensures that you’ll always stay in arms.

The AMD Leo platform is specifically targeting gaming enthusiasts who are planning to use high end systems with AMD .45 process multi-core CPUs, AMD 8 series chipsets and DX 11 graphics cards. At present a vast amount of gamers are already eagerly assembling this high-end gaming platform.

With Thermaltake’s exclusive SideClick EasySwap design in the left side panel of the ARMOR A60 AMD Leo, it’s now easier than ever to access removable hot-swap capable 3.5” hard drives. You simply place your HDD (SATA, SATA 2, SATA 3) in the drive tray, slide it into the SlideClick slot till a tiny “click” let’s you feel that the drive is connected. Without any further installation your drive will automatically be detected by your Windows operating system.

Optimized multimedia connectivity is provided for by one USB 3.0 and one USB 2.0 port in the front panel of the case. An additional eSATA connector on the top makes it most convenient to connect your mobile storage device, while the HD microphone and headset connectors in the front offer you quick and short access.

As characteristic for Thermaltake chassis, special attention had been paid to optimized ventilation and airflow. Therefore one 20 cm red exhaust LED-fan on top and one 12 cm intake red LED-fan in the front have already been pre-installed and increase the combat spirit with light-effects. One more 12 cm exhaust turbo fan on the backside top further increases air circulation. For power-users there are still four more options to install additional fans. A red geometric window on the left side panel let your graphics card shine and allows for a look at your hardware.

The feet elevate the ARMOR A60 high enough as to allow for improved ventilation of the bottom based ATX PSII power supply. To avoid outside dust to find its way into your power supply a removable dust filter is positioned underneath, providing users with an easy way to keep it clean.

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Alongside a 6-core launch for consumers, in the enterprise segment Intel will start shipping eight-core Nehalem-EX processors this month already. The pending 8-core Xeons will be able to run in four-socket servers and, by leveraging the two threads of each core, the logical CPU count can reach 64 cores on a single system.

This high scalability is complemented by 256KB L2 dedicated cache memory for each core, a shared L3 cache of 24MB and even Turbo Boost technology, which can disable unused cores in order to safely and effectively boost the heavily used ones. The 8-core also has a memory controller with four DDR3 memory channels and is built on the 45nm HKMG process (it is based on the Nehalem architecture).

The 8-cores will make their official debut later this month. In addition, Intel is preparing to formally add its Westmere-EP processors around the same time. These will be based on the 32nm Westmere process and will likely have six cores (aimed at two-socket servers), a 12MB L3 cache and three DDR3 channels.

Much like Intel decided to go for the per core overclokcing feature ‘Turbo boost’ AMD apprantly also will follow that trend by enabling a new feature called Dynamic Performance Boost for the upcoming Thuban (hexacore) processors.

The “Thuban” architecture is based on 45nm architecture and will feature an integrated DDR2/DDR3 controller. The chip is based on AMD’s six-core Opteron chip. It is expected that the piece will be called Phenom II X6.

The dynamic performance boost technology is currently known as “C-state performance boost” and will supposedly be able to detect when single-threaded operation is needed, or vice verse when multiple threads are active.

The idle CPU cores will be automatically disabled and the clocks of the ones used will be boosted to as high a level as possible. The limit will be determined by the general thermal design power.

We certainly can’t wait to see the all new Phenom II X6 “Thuban” series processors likely somewhere in April / May.

The XtremeSystems Forums member s7e9h3n got his hands on a sample of AMD’s upcoming 12-core Magny-Cours Opteron. This chip is expected to be released in Q1 2010 but s7e9h3n (don’t try to type his name fast!) already had the opportunity to do some overclocking, he managed to raise the clockspeed of the chip from 1.7GHz to 3GHz.

The sample has 12 cores, 12 threads, a 1.7GHz clock speed, 6MB of L2 cache (512KB per core), 10MB of L3, and a 1.04V core voltage. s7e9h3n actually seems to be running two of these CPUs in a sample Socket G34 motherboard packed with 8GB of 1,333MHz DDR3 memory.

The system successfully ran wPrime as well as a memory bandwidth test, in which it reached almost 42GB/s. (Socket G34 systems are supposed to have four memory channels, so if my math is right, 42GB/s is pretty much the theoretical maximum with 1,333MHz DDR3).

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An exclusive look at DFI’s upcoming codenamed “Ibex Peak” single chip design Intel P55 Express based motherboards.

DFI’s UT P55-T3eH8 and DK P55-T3eH6 motherboards that we saw today are not mass production level samples and will see some changes – you will see some hand wiring and so on that obviously won’t be there in the final shipping product. You’ll probably be able to buy them sometime in September this year, once the compatible Socket LGA-1156 Core i5 quad-core “Lynnfield” processors go on sale.

We think Intel pushed back the P55 launch again and again to allow the market to shift more of its P45 and Core 2 Duo parts before the new platform comes in and takes over the mainstream level.

P55 also supports the codenamed “Havendale” Core i5 dual-core processor which includes an on-die GPU, but we were told this will be phased out and never actually reach mass production (just for testing purposes). Instead, a newer 32nm version of it will be released sometime in Q1 next year, according to our sources.

Back onto the DFI boards – UT is DFI’s ultra high-end board and DK is a slightly cut-down version, coming in a little cheaper. The difference between the two is that the UT features a more advanced power system using a digital power management (PWM) system. UT also gets a more advanced audio add-on card as well as a better cooling system which exhausts air outside of the case – we were not shown this, DFI has to keep some surprises until Computex in a couple weeks time.

One feature you will probably notice straight away on the UT board is a the SO-DIMM like looking slot between the DDR3 DIMM slots and the IDE connector. This is an Open NAND Flash Interface (ONFI) slot that allows for an Intel made and sold 4GB or 8GB flash module to be installed to boost system performance. You can think of it as a roughly similar feature to Microsoft’s ReadyBoost in Windows Vista, but much quicker than plugging in a USB 2.0 pen drive. It acts as an extra type of cache (some are calling it “L4″ cache) and apparently you’ll even be able to access this flash memory as a hard drive and even install your main operating system on it.

Some common features on both boards – you’ll notice that the CPU socket is different from what you get on X58 and P45 boards since these boards only support Socket LGA-1156 processors – namely Core i5, as we spoke about above. Core i5 is designed to be the mainstream and cheaper version CPU of the high-end enthusiast Core i7 processor. One of the big differences is that Core i5 will only have dual-channel DDR3 support whereas Core i7 has triple-channel.

At the time of writing, DFI was unable to provide any details on pricing for either motherboard model. However, they did state a little dissatisfaction over Intel charging the same price for P55 chipsets as the P45 north and southbridge combo. Keep in mind that P55 is a single chip solution and P45 was a dual chip solution – something is clearly not quite adding up.

DFI UT P55-T3eH8 motherboard

DFI DK P55-T3eH6 motherboard

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