MSI Europe showed a nice screenshot of Elmor’s latest overclocking feat and overclocking experience with MSI’s recently announced HD 7970 Lightning card.

MSI’s Radeon HD 7970 Lightning overclocked up to 1800MHz for the GPU. Apparently all it took was some LN2 and Swedish overclocker Elmor, which proved his OC skills at various overclocking events.

The card was normally chilled by LN2 and stable core clock ended up at 1800MHz with 1700mV of voltage. Memory ended up at impressive 1925MHz (7.7GHz effective). Elmor used MSI’s Big Bang XPower II X79 motherboard and Intel Core i7 3960X Sandy Bridge-E CPU overclocked to 5207.8MHz. The 3DMark 11 score ended at 15035 marks in Performance mode.

MSI has definitely made dream graphics card for any overclocker and that custom PCB is surely doing a nice job.

Click for full resolution screenshot.

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AMD is preparing the release of a liquid cooled version of the FX-8120, which has recently been made available for pre-order by an online store in the US.

This bundle was dubbed the FX-8120 WOX by the chip maker, the WOX suffix at the end of its name pointing out that the processor is shipped together with an AMD-branded water cooler.

Besides the new bundle, the CPU supports the same specs as the regular FX-8120 according to CPU-World, meaning that it includes four Bulldozer modules to deliver a total of eight cores.

These are paired with 8MB of shared Level 3 cache memory and are clocked at 3.1 GHz, but thanks to the addition of the Turbo Core technology the CPU can reach speeds as high as 4GHz when not all cores are active.

The regular version of the FX-8120 comes bundled with an air-cooled fan/heatsink combo and has an MSRP of $205 (about 156 EUR).

In comparison, the new WOX edition FX-8120 CPU retails for $310 US (roughly 236 EUR), which makes it $105 more expensive than its air cooled version. Sadly, the availability date of the FX-8120 WOX is not yet known. Both processors are bundled with the same AMD liquid cooling solution that was developed by Asetek and supports a 120mm radiator and two fans, the latter configured to work in a push-pull mode.

The FX-8150 WOX liquid cooling bundle has an MSRP of $375 (roughly 285 EUR) and is available from various retailers, including Amazon.

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Five months after the introduction of the Opteron 6200 and Opteron 4200 processors, AMD is expanding its lineup of server chips based on the Bulldozer architecture with the launch of the single-socket Opteron 3200 series CPUs.

Right now, the Opteron 3200 processor range consists of three SKUs, namely the Opteron 3250, 3260, and 3280.

The first two of these feature dual Bulldozer modules for a total of four processing cores and their clock speeds are set at 2.4GHz and 2.7GHz (2.7GHz and 3GHz maximum Turbo), respectively.

The third chip introduced by AMD today packs eight computing cores with a base clock speed of 2.5GHz and 2.8GHz maximum Turbo. Its TDP is rated at 65 Watts, while the quad-core Opteron 3200 series CPUs fit inside a 45W power envelope.

Compared to their desktop counterparts, these three Opteron processors are validated for being used inside servers and come with an improved memory controller that supports up to 32GB of dual-channel ECC RAM running at speeds of up to 1866MHz.

The Opteron 3200 series targets the dense, power efficient 1P Web hosting/Web server market.

“In today’s economic environment, dedicated hosting providers need their data centers to become profit centers faster than ever,” said Patrick Patla, corporate vice president and general manager, commercial business, AMD.

“With the new AMD Opteron 3000 Series platform, Web and Cloud customers no longer have to compromise with desktop-class platforms in order to hit certain price points.

“Now they have all the benefits of a true server-class product at desktop-class price points. This helps rapidly-growing hosting customers achieve fast payback in their incredibly dense, power-efficient environments,” concluded the company’s rep.

Pricing for the Opteron 3250, 3260, and 3280 CPUs is set at $99, $125, and $229 (75, 94.5 and 173 EUR), respectively. All the chips are shipping right now and are available in platforms from MSI, Tyan, Fujitsu and Dell.

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Intel has threatened AMD with the termination of their x86 cross-licensing agreement, after AMD revealed its intention to spin out chip manufacturing.

The agreement – which sees AMD make PC and server CPUs using x86 architecture licensed from Intel – is believed to include a clause whereby AMD are required to manufacturer a certain proportion of chips in-house.

“Advanced Micro Devices, Inc. (the “Company”) has received correspondence from Intel Corporation (“Intel”) related to the 2001 Patent Cross License Agreement between the Company and Intel (the “Cross License”). In this correspondence, Intel (i) alleges that the Company has committed a material breach of the Cross License through the creation of the Company’s GLOBALFOUNDRIES joint venture and (ii) purports to terminate the Company’s rights and licenses under the Cross License in 60 days if the alleged breach has not been corrected”

AMD had informed company investors that the Global Foundries deal would not impact the Intel license, a reassurance that now seems premature given that Intel are alleging “material breach of the cross license”. In response, AMD have accused Intel of violating the agreement terms by threatening termination.

AMD now has 60 days to “correct” the alleged breach, but is more likely to take the case to court. Given the secret nature of the licensing agreement, it’s unlikely that many details will emerge from the legal battle.

At the Morgan Stanley Technology Conference in San Francisco yesterday, the company revealed that it had plans to enter the x86 processor market by building a x86 compatible system-on-chip in the next two to three years.

According to Michael Hara, NVIDIA’s senior vice president of investor relations and communications, the company is considering making a x86 processor in the next two or three years:

The heart of this issue is that the CPU has run its course and the soul of the PC is shifting quickly to the GPU.

If that’s true, Jen-Hsun, then why bother developing an x86 CPU? The answer, of course, is that Jen-Hsun knows his comments are little more than BS. Granted, there’s little indication that graphics processing will migrate back to CPU, in spite of a seeming plateau in mainstream applications’ polygon and pixel demands. GPUs also fill an important role in handling video processing in a speedy and power-thrifty manner. And there’s some possibility, though by no means a guarantee, that over time GPUs will take over additional functions amenable to their massively parallel processing nature, by virtue of coming-soon APIs such as OpenCL and DirectX 11. But for anyone who thinks that the GPU will obsolete the CPU or even tangibly retard its advancements in the future, I have seven words for you:

I’d like some of whatever you’re smoking.

Assuming my between-the-lines reading of Hara’s teasing is on track, where will Nvidia’s x86 capabilities come from? While I was pulling an April Fool’s joke when I ‘announced’ last year that Nvidia was buying AMD, the idea of Nvidia acquiring Via has been bantered about in the press for quite some time. There’s a problem with that prognosis, however, and it’s a biggie: Via’s x86 license isn’t capable of being adopted by an acquiring entity. Nvidia could try to do a straight-up x86 design, but (barring FTC pressure, which is perhaps what Nvidia’s gambling on), I can’t imagine a scenario in which Intel would grant its competitor a license. Emulation is also a possibility, but the track record here is spotty at best; Montalvo Systems flamed out before it ever produced its first chip, and Transmeta did little better, at least in the marketplace (in the courts, on the other hand, it fared somewhat better).

Zalman released the CNPS 9900 Max. The new CNPS 9900 Max comes with Zalman’s heat transfer solution by utilizing ‘composite heatpipe’(Q Max 300W), along with switching noise eliminated 135mm quiet LED fan for quiet operation and broad compatibility for both Intel 1156/1366/775 & AMD AM3/AM2+/AM2. This new awesome CPU cooler should be more than enough to satisfy overclockers and users who want to look for ultra powerful cooling performance in silent operation.

Key Features:

* Heat is effectively dispersed by using composite heatpipe with greater than 1.5 times the heat transfer rate of normal heatpipe and aerodynamically designed heatsink. In addition,

* Switching noise eliminated 135mm Blue or Red fan incorporated for powerful cooling performance in the ultra quiet operation

* PWM Fan automatically adjusts fan speed(RPM) according to the CPU’s temperature, while the included resistor cable(RC7P) provides the option of reducing the input voltage for overall reduction of fan speed and noise.

* Black-pearl nickel plating for long term corrosion resistance reinforce its powerful aesthetics with high intensity blue & red LEDs.

* Extreme performance super thermal grease ZM-STG2 maximizes heat transfer from the CPU to the base of CNPS9900 Max for intensified cooling performance.

* versatile compatibility of a broad range of socket Intel 1156/1366/775 & AMD AM3/AM2+/AM2.

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Twintech announced their TwinBox HL-N Series ION™ Mini PC today, which is powered by Intel Atom Processor D525 CPU with Next Generation NVIDIA ION graphics technology.

TwinBox HL-N Series ION Mini PC enables you to immerse in a qualified game and 1080P HD movie content. Linking to the TV to play 1080P HD movie is one of the important uses of a full function PC.

TwinBox HL-N Series ION™ Mini PC provides 6 x USB2.0 interfaces,1 x E-SATA interfaces,1x 6in1 interface for card reader (SD/SDHC/MS/MSPRO/XD/MMC) and 1x HDMI, 1x VGA, 1 x SPDIF-out interface. It is with on-board 802.11 Wi-Fi, Gigabit 10/100/1000 Mbps LAN Cards and supports Bluetooth® function as well. Included 2GB of DDR2 memory and optional 250GB/320GB/ 500GB HDD at suggested MSRP US$339 ~US$365.

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ECS launched the A890GXM-A2, their second revision of the AMD 890GX based Black Series motherboard.

Elitegroup Computer Systems (ECS) introduces AMD 890GX based motherboard – ECS Black Series A890GXM-A2 supports the latest six-core CPU to bring users an impressive visual experience with its tough features.

Totally Release Your Energy

By “One-step Unlocking” function in “ECS M.I.B. III” overclocking interface, users are able to unlock the hidden cores of CPU easily, and it reaches over 238% CPU performance boosted than default setting by unlocking cores with overclocking; moreover, it is also easy to reach 146% gaming performance boosted by overclocking GPU – ATI Radeon™ HD 4290 graphics processor’s core clock and SidePort memory speed; ECS A890GXM-A2 fully supports the latest AMD Turbo Core technology which is essential for power-desired users to get extra performance automatically.

ECS A890GXM-A2 is also the first motherboard provides a real PCI-E Gen.2 bandwidth SuperSpeed USB 3.0 controller enhanced by a world-leading IC manufacture in Taiwan, with this perfect solution, ECS A890GXM-A2 features attractive price in the performance segment.

Solid Products are made of Solid Features

* “ECS Anti-crash Connector Covers” protect the rear I/O like video outputs perfectly against powder, dust even and static electricity;
* Bundled “Norton Internet Security 2011” to protect system against virus and spyware;
* “ECS 15 ì Gold Contact” offers 3 times extra protection to secure the motherboard stability and durability;
* ECS 4most™ Display Design” contains HDMI, DisplayPort, DVI and D-Sub connectors on the rear panel at once;
* “ECS eBLU and ECS eDLU” applications provide the most convenient way to update BIOS and Drivers;
* “ECS eGS and ECS eSF” applications decrease power consumption and increase cooling efficiency;
* “ECS eOC” overclocking utility offers an easy and safe way to overclocking under operation system;
* “ECS eJIFFY” utility speeds up boot time and allows users to surf the internet without virus attack;
* “ECS Qooltech™ III” comes with twin-heatpipe design to enhance cooling efficiency for PWM;
* “ECS Easy Button and Easy Clear” offer an easy way to enjoy boosting system performance without hassle;
* “All solid capacitors and lower RDS(on) MOSFET” improve durability and increase up to 50% efficiency and decrease the temperatures by 16%;
* “eSATA 6.0Gbps solution” provides 2 times faster speed in accessing external storage than eSATA;

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ThermalTake launches a special AMD Leo edition of the Armor A60, this case features a red and black design and has a small side window. NewEgg is selling the case for $109.99.

Thermaltake, leading DIY chassis brand, is launching the world’s first SideClick EasySwap HDD docking mid-tower with integrated USB 3.0 SuperSpeed connector particularly designed for AMD Leo gaming PCs, the ARMOR A60 AMD Leo Edition. Thermaltake lined up with AMD to design a computer chassis particularly catering to the latest AMD Leo gaming platform. It shows the typical bullet-proof armory contours of this series while the front panel has gotten an even fiercer AMD-red color ornamentation, with the left side panel sporting an AMD Leo tattoo. The otherwise entirely black design with metal mesh elements lend the ARMOR series an extremely stylish and powerful appearance that attracts gamers and enthusiasts alike. The top and front red LED-fans enhance the overall combat ambience, resembling the typical MMORPG ambience but also providing ideal cooling characteristics for the AMD Leo platform . A special lock mechanism for your mouse and keyboard ensures that you’ll always stay in arms.

The AMD Leo platform is specifically targeting gaming enthusiasts who are planning to use high end systems with AMD .45 process multi-core CPUs, AMD 8 series chipsets and DX 11 graphics cards. At present a vast amount of gamers are already eagerly assembling this high-end gaming platform.

With Thermaltake’s exclusive SideClick EasySwap design in the left side panel of the ARMOR A60 AMD Leo, it’s now easier than ever to access removable hot-swap capable 3.5” hard drives. You simply place your HDD (SATA, SATA 2, SATA 3) in the drive tray, slide it into the SlideClick slot till a tiny “click” let’s you feel that the drive is connected. Without any further installation your drive will automatically be detected by your Windows operating system.

Optimized multimedia connectivity is provided for by one USB 3.0 and one USB 2.0 port in the front panel of the case. An additional eSATA connector on the top makes it most convenient to connect your mobile storage device, while the HD microphone and headset connectors in the front offer you quick and short access.

As characteristic for Thermaltake chassis, special attention had been paid to optimized ventilation and airflow. Therefore one 20 cm red exhaust LED-fan on top and one 12 cm intake red LED-fan in the front have already been pre-installed and increase the combat spirit with light-effects. One more 12 cm exhaust turbo fan on the backside top further increases air circulation. For power-users there are still four more options to install additional fans. A red geometric window on the left side panel let your graphics card shine and allows for a look at your hardware.

The feet elevate the ARMOR A60 high enough as to allow for improved ventilation of the bottom based ATX PSII power supply. To avoid outside dust to find its way into your power supply a removable dust filter is positioned underneath, providing users with an easy way to keep it clean.

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VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M850 Mini-ITX board, the first board to feature the latest VIA VX900 media system processor, creating the ideal solution for today’s HD-intensive, commercial multimedia-centric devices.

The VIA EPIA-M850 is targeted at OEM and ODM manufacturers of commercial multimedia embedded devices. Featuring a 64-bit, high performance VIA Nano E-Series processor and the VIA VX900 unified all-in-one media system processor, the VIA EPIA-M850 delivers a highly optimized platform that boasts comprehensive HD video performance, HD audio and HDMI support in a compact, power-efficient package.

VIA EPIA-M850: Mini-ITX with Multimedia Muscle
Measuring 17cm x 17 cm the VIA EPIA-M850 Mini-ITX board features the VIA Nano E-Series processor, available in both 1.6GHz and fanless 1.2GHz SKUs. The VIA Nano E-series is paired for the first time with the VIA VX900 MSP, supporting up to 8GB of DDR3 system memory and featuring the VIA ChromotionHD 2.0 video processor.

The VIA ChromotionHD 2.0 video engine boasts comprehensive hardware acceleration for the latest VC1, H.264, MPEG-2 and WMV9 HD formats at screen resolutions of up to 1080p without affecting CPU load. Display connectivity support includes onboard HDMI and VGA ports with pin headers for dual channel 24-bit LVDS.

The VIA VX900 boasts the VIA Chrome9™ HCM 3D integrated graphics core with full DirectX 9.0 support and a 128-bit 2D engine with hardware rotation capability. The VIA VX900 also features the VIA Vinyl HD audio codec. Storage includes ports for two SATA drives.

Rear panel I/O includes a Gigabit LAN ports, PS/2 support, HDMI port, VGA port, four USB 2.0 ports, a serial port connector and three audio jacks. An on board a PCIe x4 slot is accompanied with pin headers providing dual channel 24-bit LVDS support (including backlight control), an additional three COM ports, a further four USB 2.0 ports and one USB device port, LPC support, Digital I/O, SPDIF out and an SMBus header.

VIA EPIA-M850 Product Highlights:

* High-performance 64-bit VIA Nano-E Series processor
* Hardware acceleration for VC1, H,264 and WMV9 HD video
* On board HDMI and VGA ports, plus dual channel 24-bit LVDS
* Support for up to 8GB of DDR3

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