ThermalTake launches a special AMD Leo edition of the Armor A60, this case features a red and black design and has a small side window. NewEgg is selling the case for $109.99.

Thermaltake, leading DIY chassis brand, is launching the world’s first SideClick EasySwap HDD docking mid-tower with integrated USB 3.0 SuperSpeed connector particularly designed for AMD Leo gaming PCs, the ARMOR A60 AMD Leo Edition. Thermaltake lined up with AMD to design a computer chassis particularly catering to the latest AMD Leo gaming platform. It shows the typical bullet-proof armory contours of this series while the front panel has gotten an even fiercer AMD-red color ornamentation, with the left side panel sporting an AMD Leo tattoo. The otherwise entirely black design with metal mesh elements lend the ARMOR series an extremely stylish and powerful appearance that attracts gamers and enthusiasts alike. The top and front red LED-fans enhance the overall combat ambience, resembling the typical MMORPG ambience but also providing ideal cooling characteristics for the AMD Leo platform . A special lock mechanism for your mouse and keyboard ensures that you’ll always stay in arms.

The AMD Leo platform is specifically targeting gaming enthusiasts who are planning to use high end systems with AMD .45 process multi-core CPUs, AMD 8 series chipsets and DX 11 graphics cards. At present a vast amount of gamers are already eagerly assembling this high-end gaming platform.

With Thermaltake’s exclusive SideClick EasySwap design in the left side panel of the ARMOR A60 AMD Leo, it’s now easier than ever to access removable hot-swap capable 3.5” hard drives. You simply place your HDD (SATA, SATA 2, SATA 3) in the drive tray, slide it into the SlideClick slot till a tiny “click” let’s you feel that the drive is connected. Without any further installation your drive will automatically be detected by your Windows operating system.

Optimized multimedia connectivity is provided for by one USB 3.0 and one USB 2.0 port in the front panel of the case. An additional eSATA connector on the top makes it most convenient to connect your mobile storage device, while the HD microphone and headset connectors in the front offer you quick and short access.

As characteristic for Thermaltake chassis, special attention had been paid to optimized ventilation and airflow. Therefore one 20 cm red exhaust LED-fan on top and one 12 cm intake red LED-fan in the front have already been pre-installed and increase the combat spirit with light-effects. One more 12 cm exhaust turbo fan on the backside top further increases air circulation. For power-users there are still four more options to install additional fans. A red geometric window on the left side panel let your graphics card shine and allows for a look at your hardware.

The feet elevate the ARMOR A60 high enough as to allow for improved ventilation of the bottom based ATX PSII power supply. To avoid outside dust to find its way into your power supply a removable dust filter is positioned underneath, providing users with an easy way to keep it clean.

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New slides from a Japanese website are AMD’s roadmap for all platforms (CPU, GPU, IGP, Chipset) up to 2011. The biggest surprise is the 2010 GPU with a die shrink towards 32nm. The rumored codenames were Park, Madison and Broadway.

AMD’s soon to be launched Netbook platform, Congo, is now renamed to simply “2nd Gen UT”. With 2010, we have the Danube platform, with AMD’s first notebook quad-core CPU. In terms of GPU, 2009 is listed as ATI M9x, which is Mobility HD 4000 series. Once again, it is listed as 40nm, though the only 40nm GPU is RV740

These happen to be famous avenues in Manhattan, so the Manhattan family codename fits in well. However, notice the fab process – 32nm! Manhattan was widely rumored to be straight derivates of desktop 40nm Evergreen GPUs. Even more surprising is that it appears the DX10.1 from M9x carries on into Manhattan. Barring typos and confusing slide designs, these are both major surprises. It would appear Manhattan is not a 40nm Evergreen based GPU, but rather a 32nm M9x shrink, something that seems very unlikely. We will look out for clarification on this information.

Moving on to 2011, and Fusion hits notebooks. Sabine platform is based around the same Llano APU found in desktops. Brazos is the low-voltage platform, which seems to be manufactured at 40nm – for the complete APU.

GPU for notebooks remains next-gen Northern Islands at 32nm. The 2011 platforms increases battery life (battery life being a constant criticism for AMD’s notebook platforms) by a significant amount [via vrzone].

Information about AMDs upcoming SB850 chipset is very scarse for now, but some more details about it according to AMD’s roadmap for April 2009 are out.

The SB850 Southbridge chip will integrate the new-generation SATA 3 controller with speed of 6Gb/s, and support 6 SATA 3 interfaces and 14 USB ports. RD890 northbridge and SB850 southbridge chips are both set to launch in Mid Q4 as well as RS880D. RS880D will include RV620 (Radeon HD 3400) chip with 700MHz clock, supporting DX10.1, UVD2.0 and Hybrid CF. The southbridge will be one of the first ones to feature the third-generation SATA interface, that offers a maximum bandwidth of 6 Gbps between the system and the storage device, in comparison to 3 Gbps SATA II offers.

With RAID mode, the controller will provide RAID 0, 1, JBOD, and RAID 5 modes. Six SATA channels will be supported in all.Before the launch of 8 series IGP chipset, AMD will push 785G as the last 7 series IGP chipset at the beginning of Q3. Sharing similar specs with 780G, 785G can support DX10.1 and UVD2.0.