OC Workbench stipulated some information about a couple of upcoming Intel processors that will be released later this year. This includes the Core i7-980X, a new six-core Gulftown processor with a 3.33GHz clockspeed.

* Core i7-930″ (Bloomfield, 2.8GHz, tb/3.06GHz) 2 / 28

* “Core i7-980X Extreme Edition” (Gulftown, 3.33GHz, tb/3.6GHz) 3 / 16

* Core i5-680 (Clarkdale, 3.6GHz, tb/3.8GHz) 4 mid-May during the month

* “Core i7-880″ (Lynnfield, 3.06GHz, tb/3.73GHz) 2010/Q2

* “Core i3-550″ (Clarkdale, 3.2GHz, tb / No) 2010/Q2

* “Pentium E6700″ (Penryn, 3.43GHz) 2010/Q2

* “Core i7-970″ (Gulftown, 3.33GHz, tb/3.46GHz) 2010/Q3

G.Skill introduced ECO low-voltage DDR3 memory kits, these modules for the Intel Lynnfield platform run at a voltage of only 1.35V.

Compared to the current DDR3 standard voltage of 1.65V, G.Skill’s ECO memory modules require 18% less VDIMM. This can have a great contribution to power efficiency, environmental friendliness and ultimately saves G.Skill customers money. In addition, the lower voltages decreases a system’s operating temperature, resulting in improved stability. G.Skill’s own internal lab tests have revealed, 1.35V memory modules produce 16% lower temperatures than standard 1.65V memory.

Here’s an overview of the new G.Skill ECO DDR3 1.35V memory kits:

* G.Skill DDR3 1333 4GB (2GBx2) CL9-9-9-24 1.35V
* G.Skill DDR3 1333 4GB (2GBx2) CL8-8-8-24 1.35V
* G.Skill DDR3 1333 4GB (2GBx2) CL7-7-7-21 1.35V
* G.Skill DDR3 1600 4GB (2GBx2) CL9-9-9-24 1.35V
* G.Skill DDR3 1600 4GB (2GBx2) CL8-8-8-24 1.35V

Intel is set to release the first 32nm desktop CPUs on 3rd January 2010. Releasing first are the Clarkdale CPUs – part of the Westmere, or 32nm Nehalem die shrinks. A total of four models are expected, Core i5 650, 660 and 670, clocking in at 3.2, 3.33 and 3.46 GHz respectively. They will be priced at the $176, $196 and $284 respectively.

The other Clarkdale CPUs are the Core i3 530 and 540 covering $123-$150. The Core i3 CPUs will not feature Turbo mode. A budget Pentium G6950 is also expected at $84, without turbo, HT and 1MB less L3 cache.

Although Fudzilla clearly dates clearly dates the Core i5 Clarkdales at January 3rd, there is no mention of the Core i3 and Pentium models.

All Clarkdale CPUs come with an IGP on die, and fit into the LGA1156 socket that currently powers Lynnfield CPUs. The branding is quite a mess – further complicated by Core i5 7xx series, which are quad core Lynnfields. One might have suggested a simpler Core i7 for Bloomfield, Core i5 for Lynnfield and Core i3 for Clarkdale, but Intel did not want to differentiate them this way.

A further model, Core i5 661 is also expected. The only difference between this and the 660 is that the IGP will be clocked higher.

Once the Core i5/i3 Clarkdale CPUs hit market, it will effectively phase out the entire Core 2 range. AMD will pitch their quad cores against Clarkdale dual core/quad thread CPUs. That will be an interesting battle. Though Intel dominates the >$200 CPU market, AMD do have the better price/performance ratio in the mainstream <$200 segment. We can expect Clarkdale to fill in. It will be interesting to see how two highly-clocked cores of the powerful Westmere architecture go against four of AMD’s aging K10-based cores. One thing is certain – Clarkdales will consume far less power, and will be cheaper for Intel to manufacture. Unfortunately for AMD, we are still a long, long way away from the next-generation Bulldozer architecture.

Six new memory modules have been launched by OCZ, these all are 1.65V dual-channel 4GB DDR3 memory kits for Intel’s upcoming LGA1156 processors.

Developed for cost-conscious enthusiasts and gamers, these new OCZ modules were engineered with the same affordability and performance standards as the new Lynnfield platform. By using sophisticated IC screening methods and qualifying on a variety of motherboards, OCZ low-voltage kits are the perfect complement for the P55 Chipset and choice CPU to deliver the maximum stability. Together, P55 and OCZ memory are the premium option for the midrange desktops.

“OCZ is excited to introduce a complete range of new DDR3 dual channel memory kits that are engineered specifically for Intel’s cutting edge P55 platform,” commented Alex Mei, CMO for the OCZ Technology Group. “These gaming kits make use of high quality hand screened chips to deliver exceptional performance and stability at surprisingly low voltages when paired with the latest Intel processors and chipset.”

“I’m always excited to see the innovation that takes place when Intel’s new performance platforms are introduced into the market. In this case, OCZ & Intel are proud to deliver products that increase system responsiveness at affordable prices,” said Steve R. Peterson, Intel’s Director of Chipset Group Marketing. “The ability for a Do-It-Yourself enthusiast to build a screaming PC and still have money left over to buy some new PC games or Blu-ray videos, makes the upcoming platform introduction a hit for people of all ages.”

OCZ will release the low-voltage dual channel DDR3 kits under the award-winning Platinum and Gold series:

* OCZ DDR3 PC3-15000 Platinum Low Voltage (2x2GB) 9-9-9-27 @ 1.65V
* OCZ DDR3 PC3-15000 Gold Low Voltage (2x2GB) 10-10-10-27 @ 1.65V
* OCZ DDR3 PC3-12800 Platinum Low Voltage (2x2GB) 7-7-7-24 @ 1.65V
* OCZ DDR3 PC3-12800 Gold Low Voltage (2x2GB) 8-8-8-24 @ 1.65V
* OCZ DDR3 PC3-10666 Platinum Low Voltage (2x2GB) 7-7-7-20 @ 1.65V
* OCZ DDR3 PC3-10666 Gold Low Voltage (2x2GB) 9-9-9-20@ 1.65V

OCZ modules are 100% hand-tested for quality assurance and feature propriety XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. Furthermore, each OCZ memory kit is backed by the industry-leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.

It’s pretty obvious that Intel will release three Lynnfield processors, among them are the Core i5 750, i7 860 and i7 870. As the release date is approaching more and more news about them has popped up including a lot of p55 motherboards previews.

Over in China apparently some folks already have retail samples in their hands. This is the packaging of Core i5 750 and its stock cooler. It is priced at $196.

Check out the photo’s.

Incoming search terms:

• i5 750
• core i5 750
• core i5 packaging
• core i 5
• core i5 package
• i5-750
• i5-750s
• i5 750 쿨러
• i5 original stock heatsink
• i5 750 Quad core

Intel’s new Lynnfield could show up in stores as early as September.

The new 45nm CPUs will all be Socket 1156 flavored and should also come in speeds of 2.66, 2.8 and 2.93GHZ. a Dual Channel DDR3 memory controller will be build into the CPU with official support for up to 1333MHz memory.

Interestingly the 2.66GHz version will not have Hyper-Threading.

Pricing is looking to be $196 for the 2.66, $284 for the 2.8 and $562 for the 2.93. The P55 board to support these new CPUs should start popping up in August (there are even some early benchmarks showing up now).

Lynnfield should fill in the gap between the expensive i7 CPUs and the older Core 2 architecture.

While many motherboard manufacturers are taking the time at Computex to show off motherboards based upon Intel’s P55 chipset, ASUS is showing off a little bit more.

Dubbed the P7P57 motherboard, it is based upon Intel’s P57 express chipset and is ready to support Lynnfield and Clarkdale CPUs when they arrive. ASUS didn’t shed too much light on the motherboard, but we did learn that it will support Intel’s Braidwood technology as well as dual-channel DDR3 support.

ASUS also said that the board wil have an 8-phase power design and EPU for system level energy efficiency. It is a little interesting how ASUS brags about more phases giving the board more power then immediately points out that it will be energy efficient.

Incoming search terms:

• desktop asus sabertooth p57

While Intel has yet to official confirm the exact launch date for the Core i5 platform including Lynnfield based processors, it can’t be too far off when benchmarks are being leaked to the web already.

(Click the above image for the large version)

The quad-core Core i5 2.66GHz processor ran through the benchmark gauntlet on a reference Intel P55 motherboard, outperforming a dual-Xeon L5320 system and even besting the Qx9650 chip in a few of the tests. The good news is that there will be two more Lynnfield chips as launch that will be even faster, and the 2.66GHz part is expected to hit the market at $196.

Incoming search terms:

• core i5
• DELL PRECISION 450 DUAL XEON MOTHERBOARD
• image of core i5

An exclusive look at DFI’s upcoming codenamed “Ibex Peak” single chip design Intel P55 Express based motherboards.

DFI’s UT P55-T3eH8 and DK P55-T3eH6 motherboards that we saw today are not mass production level samples and will see some changes – you will see some hand wiring and so on that obviously won’t be there in the final shipping product. You’ll probably be able to buy them sometime in September this year, once the compatible Socket LGA-1156 Core i5 quad-core “Lynnfield” processors go on sale.

We think Intel pushed back the P55 launch again and again to allow the market to shift more of its P45 and Core 2 Duo parts before the new platform comes in and takes over the mainstream level.

P55 also supports the codenamed “Havendale” Core i5 dual-core processor which includes an on-die GPU, but we were told this will be phased out and never actually reach mass production (just for testing purposes). Instead, a newer 32nm version of it will be released sometime in Q1 next year, according to our sources.

Back onto the DFI boards – UT is DFI’s ultra high-end board and DK is a slightly cut-down version, coming in a little cheaper. The difference between the two is that the UT features a more advanced power system using a digital power management (PWM) system. UT also gets a more advanced audio add-on card as well as a better cooling system which exhausts air outside of the case – we were not shown this, DFI has to keep some surprises until Computex in a couple weeks time.

One feature you will probably notice straight away on the UT board is a the SO-DIMM like looking slot between the DDR3 DIMM slots and the IDE connector. This is an Open NAND Flash Interface (ONFI) slot that allows for an Intel made and sold 4GB or 8GB flash module to be installed to boost system performance. You can think of it as a roughly similar feature to Microsoft’s ReadyBoost in Windows Vista, but much quicker than plugging in a USB 2.0 pen drive. It acts as an extra type of cache (some are calling it “L4″ cache) and apparently you’ll even be able to access this flash memory as a hard drive and even install your main operating system on it.

Some common features on both boards – you’ll notice that the CPU socket is different from what you get on X58 and P45 boards since these boards only support Socket LGA-1156 processors – namely Core i5, as we spoke about above. Core i5 is designed to be the mainstream and cheaper version CPU of the high-end enthusiast Core i7 processor. One of the big differences is that Core i5 will only have dual-channel DDR3 support whereas Core i7 has triple-channel.

At the time of writing, DFI was unable to provide any details on pricing for either motherboard model. However, they did state a little dissatisfaction over Intel charging the same price for P55 chipsets as the P45 north and southbridge combo. Keep in mind that P55 is a single chip solution and P45 was a dual chip solution – something is clearly not quite adding up.

DFI UT P55-T3eH8 motherboard

DFI DK P55-T3eH6 motherboard

Incoming search terms:

• DFI P45-T2RS Plus
• dfi p45 hybrid
• dfi special force
• sf dfi
• dfi x58
• DFI P45
• toshıba satellite L635 BIOS CHIP
• smart pwm dfi x58
• sf dfi video
• sf dfi pictures

Rumors on the web claim that Intel has delayed the launch of its P55 chipset and Lynnfield (Core i5) processors. Originally, it was thought that Intel would launch these chips at Computex but it seems the chip giant has different plans now.

Motherboards based on the Intel P55 chipset will be shown off at Computex in June, but a launch isn’t expected until August/September or perhaps even as late as October. It’s said that Intel is revising the P55 and bringing forward some features of the P57 chipset.

We’re not sure when to expect the actual launch, as we’ve heard August-September from some and now we’re hearing as late as October. Maybe Intel is biding their time, as they don’t feel enough pressure from AMD and the Core 2 range is still doing pretty well in comparison to the Phenom II.

The Core i5 platform isn’t exactly exciting, as it seems to have a lot of drawbacks and very few advantages to the consumer over the Core 2 platform and unless it offer something better, we doubt that people will bother to upgrade, especially considering the current economic climate, which could also be a reason why Intel is holding things back.