The Momentus XT drive also features Adaptive Memory – a groundbreaking new technology from Seagate that learns and optimizes the drive’s performance to each user by moving frequently used information into the flash memory for faster access. The Momentus XT solid state hybrid drive boots up to 100 percent faster than traditional 5400RPM drives, the mainstream spin speed for laptop PCs, and sets new benchmarks for real-world system performance for laptops and gaming systems.

Today’s high-performance SSDs for mobile computing cost as much as 10 times more than hard disk drives of the same capacity, with the price of a 250GB SSD outstripping even the cost of many laptop PCs. As a result, most consumers and system builders are unwilling or unable to pay the high price for the greater speed and quiet operations of SSDs. Additionally, SSDs offer fewer capacity options than hard disk drives.

The Momentus XT drive is a best-of-both-worlds solution that combines a 7200RPM spin speed, 4GB of solid state memory and Seagate’s Adaptive Memory technology to deliver unprecedented hard drive performance. The unique Adaptive Memory technology works by identifying patterns in how often certain digital data is used, and then moving the most frequently used information to the embedded solid state memory for faster access – effectively tailoring hard drive performance to each user and their applications.

Momentus XT Drive Brings Unprecedented Speed to New ASUS Gaming Laptop PC
ASUS has also announced that it will offer the Momentus XT drive as an upgrade option for its new Republic of Gamers (ROG) G73Jh notebook. The system is powered by an Intel i7 720Qm quad-core processor, 8GB of DDR3 memory, and DX11 capable ATI Radeon Mobility HD 5870.

High-performance 24GB Dominator kit for Core i5/i7 systems. 1600MHz, 9-9-9-24, 1.65v
Key Features

* Maximize your system memory capacity for the maximum performance
* Guaranteed to work on all dual-channel Core i5/i7 platforms
* Matching Intel Blue Heat Sinks with patented DHX technology

The 4GB memory modules are tested at 1600MHz, 9-9-9-24 latency and Dominator Airflow Fan with 60mm fans. The introduction of these new kits expands Corsair’s worldwide award-winning Dominator memory family, providing an exciting new level of performance for data-intensive computing applications. Corsair’s 24GB Dominator DDR3 memory kit has been rigorously qualified and tested in platforms based on the Intel® X58 chip set. It is designed for use with three-channel CPUs such as the Core™ i7 980X processor. The 16GB Dominator DDR3 memory kit is designed for use on dual channel platforms based on the P55 chip set. Both module kits include Corsair’s patented DHX+ technology, and feature racing-blue highlights and fins.

“We continue to see increasing demand for high density solutions from programmers, scientists, videographers, and other data-intensive users,” stated John Beekley, VP of Technical Marketing at Corsair. “These new 1600MHz modules will enable a new level of processing speed for handling these large data sets.”

The 16GB and 24GB 1600MHz Dominator DDR3 memory kits are available immediately from the Corsair Store.

Better chunk out some cash though, the 16GB kit (dual-channel) will set you back 999 USD and the 24GB set (triple channel) a lovely 1449 USD (!)

Intel XMP is a performance-packed expansion of the standard DDR3 memory specification. Featuring memory bandwidth up to an incredible 32GB/s, Transcend`s aXeRam DDR3-2000 dual-channel memory kit is rated at 2000MHz with timings of 9-9-9-24, allowing performance enthusiasts and gamers to take their Intel Core i7 platform to the next level of memory overclocking performance. The aXeRam DDR3-2000 memory modules have been certified for use on Intel P55-based motherboards, including Gigabyte GA-P55A-UD3, MSI P55-GD80 and Asus P7P55D Deluxe.

To ensure extra stability and signal integrity at high clock speeds, all aXeRam modules are comprised of 128Mx8 high-quality DDR3 FBGA chips and use robust eight-layer PCBs that fully comply with rigorous JEDEC (Joint Electron Device Engineering Council) standards. With premium DRAM chips and high thermal efficiency aluminum heat sinks, the aXeRam DDR3 memory modules deliver amazing overclocking performance while maintaining cool temperatures. The certification report is posted here.

Samsung Electronics announced today that it has begun shipping samples of the industry’s highest-density memory module for server systems. The 32 gigabyte (GB) module has been designed for use in advanced servers, which require high-density and high-performance features at low-power consumption levels.

Samsung is using the industries highest-density monolithic DDR3 device – a 40-nanometer (nm) class, four gigabit (Gb) DDR3 chip – as the building block for the new 32GB module. This comes just one year after the company announced its 50nm-class 2Gb based, 16GB registered dual inline memory module (RDIMM) last March.

The highly-efficient 32GB RDIMM consists of 36 dual-die 40nm-class 4Gb DDR3 chips that can perform at equal or greater levels to a 40nm-based 16GB RDIMM with no increase in power consumption. By equipping a dual CPU, two-way server with 32GB modules, a server system can have up to 384GB of memory. This allows for doubling the previously largest density of 192GBs per server with a power increase of less than five percent over that needed for a 16GB module-based system.

In addition, replacing 12 DRAM modules of 16GB density with just six 32GB modules would achieve a 192GB total density, while allowing the DRAM operating speed in a two-way server system to rise by 33 percent from 800 megabit per second (Mbps) to 1,066 Mbps, as power is cut by 40 percent.

In high-performance, four-way servers using 16GB modules, one terabyte of DRAM would be commonplace.By using 32GB RDIMMs, Samsung is moving toward providing four-way servers with 2TB of DRAM each, a migration that it believes will spur introduction of diverse software and a broader scale of server applications.

Mass production of the 32GB RDIMM is slated to begin next month.

The 2400MHz kit runs at 9-11-9-27-2 timings at 1.65 volts and was developed for enthusiasts, gamers, and benchmarkers looking to scale new memory heights. As with all Kingston memory, the 2400MHz kit was created with the highest design-engineering principles and subjected to OEM-quality production and testing standards to gain Intel XMP certification.

The memory was tested to great success on several P55-based systems including the GIGABYTE GA-P55A-UD4P motherboard. The 2400MHz kits will be available in Q2. Kingston HyperX memory is backed by a lifetime warranty and free 24/7 technical support.

This high scalability is complemented by 256KB L2 dedicated cache memory for each core, a shared L3 cache of 24MB and even Turbo Boost technology, which can disable unused cores in order to safely and effectively boost the heavily used ones. The 8-core also has a memory controller with four DDR3 memory channels and is built on the 45nm HKMG process (it is based on the Nehalem architecture).

The 8-cores will make their official debut later this month. In addition, Intel is preparing to formally add its Westmere-EP processors around the same time. These will be based on the 32nm Westmere process and will likely have six cores (aimed at two-socket servers), a 12MB L3 cache and three DDR3 channels.

Kingston Technology Co., Inc., the independent world leader in memory products, today announced the release of the world’s first ultra-low voltage memory running at 1.25 volts at 1600MHz. The new offering is part of the new Kingston® ‘LoVo’ (low voltage) HyperX® DDR3 High-Performance memory product line. The dual-channel kit (Kingston part #: KHX1866C9D3LK2/4GX) comes preprogrammed with two XMP-ready profiles: 1.25 volts at 1600MHz and 1.35 volts at 1866MHz. The latter profile is also a world’s first for speed matching higher frequency with a lower voltage.

“Kingston is proud to lead the charge with memory for the new generation of energy efficient systems that yield higher performance,” said Mark Tekunoff, senior technology manager, Kingston. “Energy-conscious consumers need to look no further for memory than the HyperX ‘LoVo’ line when they are assembling the components needed to achieve better PC power performance.”

The flagship product, running an ultra-low 1.25 volts at 1600MHz, is the lowest voltage to date for desktop PCs. In all, Kingston is debuting three HyperX DDR3 dual-channel products in the ‘LoVo’ line: the dual-profile kit, a mainstream low voltage 1600MHz, 1.35 volt kit and an ultra-low voltage 1333MHz, 1.25 volt kit. Kingston tested all three kits to great success on the Asus P7P55D EVO motherboard. All of the memory offerings are designed for use in eco-friendly PCs as systems delivering higher performance while using smaller energy footprints become reality.

Kingston HyperX memory is backed by a lifetime warranty and free 24/7 technical support.

Specifications:

* KHX1866C9D3LK2/4GX (XMP Profile 1): 4GB 1866MHz (CL9-9-9-27 @ 1.35v low voltage) kit of 2 for XMP – $203

* KHX1866C9D3LK2/4GX (XMP Profile 2): 4GB 1600MHz (CL9-9-9-27 @ 1.25v ultra-low voltage) kit of 2 for XMP – $203

* KHX1600C9D3LK2/4GX: 4GB 1600MHz (CL9-9-9-27 @ 1.35v low voltage) kit of 2 for XMP – $158

* KHX1333C9D3UK2/4GX: 4GB 1333MHz (CL9-9-9-27 @ 1.25v ultra-low voltage) kit of 2 for XMP – $154

Both kits are working at the same specs so you’ll end up with a 1600MHz kit with 7-7-7-20 latencies at 1.65V. Although the dual channel 8GB kit is meant for Intel’s Socket LGA 1156 processors, we are pretty sure that you won’t have any trouble running it on an AMD-based platform as well.

Both kits use Mushkin’s black painted Frostbite heatspreaders and are backed by a lifetime warranty. Unfortunately, Mushkin didn’t announce a price for these two, but we guess that they will show up in retail/e-tail pretty soon.

Compared to the current DDR3 standard voltage of 1.65V, G.Skill’s ECO memory modules require 18% less VDIMM. This can have a great contribution to power efficiency, environmental friendliness and ultimately saves G.Skill customers money. In addition, the lower voltages decreases a system’s operating temperature, resulting in improved stability. G.Skill’s own internal lab tests have revealed, 1.35V memory modules produce 16% lower temperatures than standard 1.65V memory.

Here’s an overview of the new G.Skill ECO DDR3 1.35V memory kits:

* G.Skill DDR3 1333 4GB (2GBx2) CL9-9-9-24 1.35V
* G.Skill DDR3 1333 4GB (2GBx2) CL8-8-8-24 1.35V
* G.Skill DDR3 1333 4GB (2GBx2) CL7-7-7-21 1.35V
* G.Skill DDR3 1600 4GB (2GBx2) CL9-9-9-24 1.35V
* G.Skill DDR3 1600 4GB (2GBx2) CL8-8-8-24 1.35V

OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today expanded their lineup of DDR3 to include certified OCZ Black Edition 4GB kits for ultimate compatibility with AMD’s next-generation Phenom® II processors. These modules excel on Black Edition platforms at ultra-low voltage, an ideal parameter for the latest highly efficient processors. OCZ’s unique Black Edition Series is designed to be the ultimate upgrade for users who not only want to reap the benefits of high-frequency DDR3, but want a future-proof choice for their system.

“OCZ is excited to launch our new AMD Black Edition Ready Series which is designed specifically to work with AMD’s OverDrive™ software utility,” said Eugene Chang, Vice President of Product Management at the OCZ Technology Group. “The new OCZ Black Edition modules not only interact with AOD to overclock the memory, but also communicate with the BIOS to increase the frequency and performance of the memory controller. The result is a symbiotic relationship between memory and the rest of the system to unleash the full power of the Dragon Platform.”

“We are thrilled to see OCZ develop the Black Edition modules exclusively for Socket AM3 platforms featuring AMD Phenom™ II processors,” said Bob Grim, Director, Client Product Marketing, AMD. “By supporting AMD Black Edition Memory Profiles, OCZ enables overclockers to achieve higher levels of performance intelligently through dynamic profiles as opposed to simple, static SPD parameters.”

OCZ Black Edition kits are tested and qualified specifically for AMD’s own “Black Edition” Phenom CPU’s for ultimate performance and stability. Featuring the exclusive AMD OverDrive™ (AOD) feature, users can unleash the remote stored profiles when used with 790FX / 790GX motherboards, giving the cutting-edge with instant “plug and play” functionality. This highly advanced AOD feature detects your OCZ Black Edition RAM when used in conjunction with certified motherboards and processors, where the data is then sent to a remote AMD server to download the correct profiles and get your system up and running at its peak. Eliminating the need for manual overclocking, the AOD does all the work for you as you charge through your games and computing tasks.

OCZ Black Edition modules feature the high densities and blazing DDR3 speeds enthusiasts and gamers demand to make the most of the graphic-intensive PC titles and applications, and will be available as DDR3 PC3-12800 4GB kits operating at 1.65V. Each module comes with an exclusive AMD-branded XTC (Xtreme Thermal Convection) heat spreader and is backed by the industry-leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.