ECS launched the A890GXM-A2, their second revision of the AMD 890GX based Black Series motherboard.

Elitegroup Computer Systems (ECS) introduces AMD 890GX based motherboard – ECS Black Series A890GXM-A2 supports the latest six-core CPU to bring users an impressive visual experience with its tough features.

Totally Release Your Energy

By “One-step Unlocking” function in “ECS M.I.B. III” overclocking interface, users are able to unlock the hidden cores of CPU easily, and it reaches over 238% CPU performance boosted than default setting by unlocking cores with overclocking; moreover, it is also easy to reach 146% gaming performance boosted by overclocking GPU – ATI Radeon™ HD 4290 graphics processor’s core clock and SidePort memory speed; ECS A890GXM-A2 fully supports the latest AMD Turbo Core technology which is essential for power-desired users to get extra performance automatically.

ECS A890GXM-A2 is also the first motherboard provides a real PCI-E Gen.2 bandwidth SuperSpeed USB 3.0 controller enhanced by a world-leading IC manufacture in Taiwan, with this perfect solution, ECS A890GXM-A2 features attractive price in the performance segment.

Solid Products are made of Solid Features

* “ECS Anti-crash Connector Covers” protect the rear I/O like video outputs perfectly against powder, dust even and static electricity;
* Bundled “Norton Internet Security 2011” to protect system against virus and spyware;
* “ECS 15 ì Gold Contact” offers 3 times extra protection to secure the motherboard stability and durability;
* ECS 4most™ Display Design” contains HDMI, DisplayPort, DVI and D-Sub connectors on the rear panel at once;
* “ECS eBLU and ECS eDLU” applications provide the most convenient way to update BIOS and Drivers;
* “ECS eGS and ECS eSF” applications decrease power consumption and increase cooling efficiency;
* “ECS eOC” overclocking utility offers an easy and safe way to overclocking under operation system;
* “ECS eJIFFY” utility speeds up boot time and allows users to surf the internet without virus attack;
* “ECS Qooltech™ III” comes with twin-heatpipe design to enhance cooling efficiency for PWM;
* “ECS Easy Button and Easy Clear” offer an easy way to enjoy boosting system performance without hassle;
* “All solid capacitors and lower RDS(on) MOSFET” improve durability and increase up to 50% efficiency and decrease the temperatures by 16%;
* “eSATA 6.0Gbps solution” provides 2 times faster speed in accessing external storage than eSATA;

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EVGA introduced the X58 Classified3 motherboard, this model is nearly similar to it’s predecessor but now features SATA 6Gbps as well as USB 3.0 support.

Based off of the original record-shattering “Classified” design, EVGA has pushed the envelope even further on design and performance by adding the next generation high speed USB3 and SATA 3/6G Ports. These additions allow the extreme performance potential of this highly overclockable motherboard to be unleashed without reservation or delay when paired with a lightning fast SATA3/6G SSD or other high performance drive.

With the capability to RAID the two attached next-generation SATA ports, you can get even more from the ultimate high performance experience.As more devices appear with the USB 3 and SATA 3/6G interface, gamers and overclockers alike will have the ultimate in overclocking performance now and be ready for the next generation.

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ThermalTake launches a special AMD Leo edition of the Armor A60, this case features a red and black design and has a small side window. NewEgg is selling the case for $109.99.

Thermaltake, leading DIY chassis brand, is launching the world’s first SideClick EasySwap HDD docking mid-tower with integrated USB 3.0 SuperSpeed connector particularly designed for AMD Leo gaming PCs, the ARMOR A60 AMD Leo Edition. Thermaltake lined up with AMD to design a computer chassis particularly catering to the latest AMD Leo gaming platform. It shows the typical bullet-proof armory contours of this series while the front panel has gotten an even fiercer AMD-red color ornamentation, with the left side panel sporting an AMD Leo tattoo. The otherwise entirely black design with metal mesh elements lend the ARMOR series an extremely stylish and powerful appearance that attracts gamers and enthusiasts alike. The top and front red LED-fans enhance the overall combat ambience, resembling the typical MMORPG ambience but also providing ideal cooling characteristics for the AMD Leo platform . A special lock mechanism for your mouse and keyboard ensures that you’ll always stay in arms.

The AMD Leo platform is specifically targeting gaming enthusiasts who are planning to use high end systems with AMD .45 process multi-core CPUs, AMD 8 series chipsets and DX 11 graphics cards. At present a vast amount of gamers are already eagerly assembling this high-end gaming platform.

With Thermaltake’s exclusive SideClick EasySwap design in the left side panel of the ARMOR A60 AMD Leo, it’s now easier than ever to access removable hot-swap capable 3.5” hard drives. You simply place your HDD (SATA, SATA 2, SATA 3) in the drive tray, slide it into the SlideClick slot till a tiny “click” let’s you feel that the drive is connected. Without any further installation your drive will automatically be detected by your Windows operating system.

Optimized multimedia connectivity is provided for by one USB 3.0 and one USB 2.0 port in the front panel of the case. An additional eSATA connector on the top makes it most convenient to connect your mobile storage device, while the HD microphone and headset connectors in the front offer you quick and short access.

As characteristic for Thermaltake chassis, special attention had been paid to optimized ventilation and airflow. Therefore one 20 cm red exhaust LED-fan on top and one 12 cm intake red LED-fan in the front have already been pre-installed and increase the combat spirit with light-effects. One more 12 cm exhaust turbo fan on the backside top further increases air circulation. For power-users there are still four more options to install additional fans. A red geometric window on the left side panel let your graphics card shine and allows for a look at your hardware.

The feet elevate the ARMOR A60 high enough as to allow for improved ventilation of the bottom based ATX PSII power supply. To avoid outside dust to find its way into your power supply a removable dust filter is positioned underneath, providing users with an easy way to keep it clean.

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Lian Li Industrial Co. Ltd. today announces two additional V-series – PC-V1020 mid-tower chassis & PC-V2120 full-tower chassis for the professional PC users.

Continuously following the layout from the previous V-series models, Lian Li also upgrades functionality to the latest requirements of performance computing. Huge internal space for the largest graphics cards, support for 8 or 11 PCI slots, enough space for the gigantic HPTX motherboard, easily removable motherboard tray, front door for security and quality…plus the front grill design with holes are all the advanced features of this series. No matter if it’s for professional workstation, server or high-end system, gamers or pro-users, the all aluminum alloy with simple and yet stylish look of Lian Li’s PC-V1020 & PC-V2120 are made for users looking for absolute choices.

The Lian Li PC-V1020 Mid-Tower Chassis
Dimensioned at 220x562x505mm(W.H.D.), weights only at 9.15kg, stunning front grill design with holes, and available in three colors of black, silver and red. The PC-V1020 features 5.25″ standard optical drive x3; 5.25″ to 3.5″ converter optical drive x1; 3.5″ HDD x7; 2.5″ HDD x1. It supports ATX/Micro-ATX motherboards mounted on a motherboard bay that slides out on the back easily. Equipped with 8 PCI slots which can hold three or more graphics cards up to 305mm length supporting Crossfire™ and SLI™, this case allows full graphics power.

The Lian Li PC-V1020 is designed for an outstanding supply of cool air, offering two 140mm blue/red LED fans at the front, special cage for a 140mm at the top and one 120mm fan at the rear to draw the hot air out. Last but not least, an air filter is available to cover the vent underneath the mounted power supply unit at the bottom of the PC-V1020.

It is worth to mention that there is a set of wheels at the base of PC-V1020, for users to move the case around and lock the wheels in position. Other friendly package of Lian Li’s PC-V1020 includes all I/O ports on the top cover for easy access; a PCI bracket connecting USB3.0 cable from I/O ports to the motherboard; the removable motherboard trays and thumb screw; tool-less optical drive mounting with rubber padding as well as tool-less HDD cage; an opening hole for cables as well as patented cable management clamp; and finally, an optional PCI Cooling Kit with 140mm fan for direct cooling of the expansion cards.

The Lian Li PC-V2120 Full-Tower HPTX Chassis
Dimensioned at 235x635x630mm(W.H.D.), it is designed to handle even the largest motherboard on the market for power users. Despite the enormous size and echoing internal space it only weights 14.4kg. The Lian Li PC-V2120 has a huge internal space that supports HPTX motherboards as well as 11 PCI slots for graphics cards up to 335mm long, and still enough room to fit five 5.25″ standard optical drives and 13 hard drives. The motherboard tray slides out on the back of the chassis, making it easy to set up the system despite of the size of the components. Access to the front bays is secured with lockable door with noise reduction foam, while the side panels can be secured with locks. The door opening direction can be easily changed from left to right swing.

For air flow the PC-V2120 has three 140mm cooling fans in the front, one 120mm fan on the back, plus three pre-cut 120mm fan mounting holes on the top cover for more fans or watercooling radiators. A tray is separating the motherboard compartment from the PSU and storage space on the bottom of the case. Besides having openings for cable management it also offers mounting holes for two 2.5” drives for an easy access compared to the narrow confines of the 3.5” bays. On the front there is a fan controller for users to adjust the fan speed and get the best balance between silent and cooling. Just like the PC-V1020, there is an optional PCI Cooling Kit with 140mm fan for direct cooling of the expansion cards, vents on the PCI brackets, plus fire protected vents below the power supply unit with an air filter for dust protection.

The wheels design enables easy moving of the heavy system. Other details like the USB 3.0, easy I/O ports access, noise reduction on side panels, cable management clamp, motherboard thumb screws and etc. make the PC-V2120 most ideal for professional workstations, small server and the ultimate gaming rig.

For more details on features and extras availabilities, please check out the product pages of Lian Li PC-V1020 and Lian Li PC-V2120.

PC-V1020 Mid-Tower Chassis:

* Support ATX/Micro-ATX motherboards
* Motherboard tray sliding out on back
* 5.25″ standard optical drive x3
* 5.25″ to 3.5″ converter optical drive x1
* 3.5″ HDD x7 and 2.5″ HDD x1
* 8 PCI slots for VGA cards up to 305mm length
* Two 140mm blue/red LED fans at front
* One 140mm fan at top
* One 120mm fan at rear
* USB3.0 x 4 / e-SATA x 1 / HD Audio I/O ports
* Availability: Arriving at local distributors end of September
* MSRP for PC-V1020 (VAT not included): US$289 for PC-V1020A/B (silver/black); US$349 for PC-V1020R (red)

PC-V2120 Full-Tower Chassis:

* Support ATX/Micro-ATX/HPTX motherboards
* Motherboard tray sliding out on back
* 5.25″ standard optical drive x5
* 3.5″ HDD x10 and 5.25″ HDD x3
* 11 PCI slots for VGA cards up to 335mm length
* Three 140mm fans + one 120mm fan at front
* Three 120mm fan holes at top
* One 120mm fan at rear
* USB3.0 x 4 / e-SATA x 1 / HD Audio I/O ports
* Availability: Arriving at local distributors end of September
* MSRP for PC-V2120 (VAT not included): US$459 for PC-V2120A/B; US$539 for PC-V2120X (all black)

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Intel demonstrated 10Gbps Light Peak at the IDF in San Francisco, the company said chips for the optical interconnect will be available in 2011 and the first computers with Light Peak could hit the market in 2012.

One big question is what this means for USB 3.0, but a spokesperson of the chip giant told EE Times that Light Peak and USB 3.0 could serve complimentary roles. The Intel spokesman said Light Peak and USB 3.0 could both be used on future systems and serve complimentary roles. USB 3.0 supports rates up to 5 GigaTransfers/second and data transfers of at least 300 Mbytes/second.

A representative from Texas Instruments estimated as many as 40 million notebooks could ship with USB 3.0 next year. The company will sample before the end of the year a four-port USB 3.0 controller that requires no external flash and will sell for about four dollars in 100,000 unit quantities.

Intel is expected to deliver chip sets supporting USB 3.0 by 2012, driving the technology into mainstream systems.

Lian Li makes some very cool computer cases for all sorts of uses. A couple of its new PC cases have been unveiled called the PC-Q09 and the PC-Q09F. These cases have a mounting kit that is optional that will allow the user to hide the case behind their monitor. Typically, only tiny computers can be hidden behind the screen on your desk.

The PC-Q09 is a smaller chassis measuring in at 256 x 110 x 200mm and weighing 1.4kg. The little case has a slim CD-ROM optical drive and a standard 2.5-inch HDD slot along with a standard 110W mini-ITX PSU with an external power brick allowing the chassis to be thinner and lighter with less heat output inside the chassis.

The chassis is covered in 1.5mm thick aluminum. The little case uses passive cooling with top and side vent holes and an 80mm fan can be put on the side of the chassis. Other features include a pair of USB 3.0 ports and more on the front cover. The PC-Q09F is 265 x 124 x 200mm and weighs 2.1kg. The extra size and weight of the case the due to the integrated 150W Flex ATX PSU.

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OCZ is expected to introduce its Enyo USB 3.0 solid state disk by mid-May. This device will ship in capacities of 64GB, 128GB and 256GB, and the faster models promises read speeds of up to 260MB/s and write speeds of up to 200MB/s. Pricing is expected to be in the range of the SandForce-based Vertex 2 SSD, likely slightly higher.

The OCZ Enyo will be available in 64, 128 and 256GB volume sizes and all three drives use MLC NAND flash memory, have 64MB of on board cache and USB 3.0 Micro B connector interface.

Since we are talking about a USB 3.0 SSD-based external drive, you can expect speeds of up to 260MB/s for read and up to 200MB/s for write, with sustained speeds of up to 150MB/s for 128GB and 256GB versions. The 64GB one will have a bit lower speeds of up to 225MB/s for read and up to 135MB/s for write with sustained write of up to 40MB/s.

Power Quotient International (PQI) released its latest USB flash-drive, the CoolDrive U368. Among a small, growing group, the U368 is USB 3.0 SuperSpeed compliant, and offers transfer-rates on par with hard drives, with access times comparable to those of SSDs.

Its casing is typically-shaped, measuring 90.1 x 22 x 11.1 mm, and weighing 25 g. When connected using USB 3.0, the drive offers transfer speeds of around 105 MB/s, which can be improved with the bundled TurboFlash USB software. It is available in capacities ranging from 8 GB, all the way up to 128 GB. It is backwards-compatible with USB 2.0, albeit with lower transfer-rates. Pricing and availability are yet to be known.

There’s probably a very good reason why Intel is trying to stall chipset support for USB 3.0, they’d like it much more if they could control the market with their own patents and licenses. But that doesn’t mean they have something really interesting in their hands though.

Intel unveiled Light Peak technology, with which they hope to ultimately replace the profusion of different cables sprouting from today’s PCs with a single type of fiber-optic link.

“We hope to see one single cable,” Perlmutter said, adding that one thing getting in the way of smaller laptops is the profusion of cable ports around the systems’ edges.

This prototype PC has the Light Peak controller and optical connector that sends signals down a single white optical cable. It will reach 100 gigabits per second in the next decade, said Jason Ziller, Intel’s director of optical input-ouput program office, in an interview. The company envisions Light Peak as a replacement for the cables that currently lead to monitors, external drives, scanners, and just about anything else that plugs in to a computer. A PC could have a number of Light Peak ports for different devices, or a connection could lead to a hub–perhaps an external monitor–with multiple connections of its own, Ziller said. It’s not clear how much the technology will cost or how many years it will take to become mainstream. And wireless communication technology–Intel itself has promoted Ultra-Wideband (UWB) for years–offers the attraction of getting rid of some cables altogether.

The Light Peak technology handles multiple communication protocols at the same time, with quality-of-service provisions to ensure high-priority traffic such as video get preferred treatment, he said.

Intel’s Dadi Perlmutter traces the Light Peak cable from a PC to a monitor on the other side of the stage. Light Peak can traverse distances up to 100 meters. The cables themselves are durable, Ziller said: “You can tie a knot in it and it’ll still work.” Intel has a lot of clout in the computing marketplace, but building support for a radical new connection that could replace DVI, DisplayPort, USB, Firewire, HDMI, and any number of other connections would require broad industry support. Intel’s taking the usual approach to tackling that problem:

“We’re working with the industry to standardize it,” Ziller said. Intel has been briefing other companies for “the last few months,” and now is trying to get the standards process started in earnest with partners including companies in the computing, consumer electronics, and telephone handset markets, he said. Ziller wouldn’t say who else is participating in the effort, but Intel published a statement of support from Sony, which has a lot of clout of its own in many markets. “Sony is excited about the potential for Light Peak technology that Intel has been developing, and believe it could enable a new generation of high-speed device connectivity,” said Ryosuke Akahane, vice president of Sony’s Vaio Business Group.

So will Light Peak become a universal port? “Intel’s long-term vision is you could get to that,” Ziller said.

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Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced the new USB 3.0 Express™ Drive. Available in 16GB and 32GB capacities, this new drive supports USB 3.0 speeds of up to 125MB/s. Downloading a 600MB movie takes only a mere 12 seconds with this new drive. And the company expects to improve this performance even further in coming weeks by applying their advanced driver technology.

“This product underscores Super Talent’s continued leadership in the USB 3.0 storage market.”, said Super Talent COO, C.H. Lee. “We’ve listened to our customers and responded with a USB 3.0 product that not only meets the market needs but hits the balance point between price and performance.”

Measuring 62 x 37 x7.5 mm, the new Express Drive requires no separate cable and is fully backward compatible with USB 2.0 ports, at USB 2.0 speeds. Both the USB 3.0 RAIDDrive™ and USB 3.0 Express™ drive use Super Talent’s patented technology and are protected under US Patent # 7457897.

The USB 3.0 Express will be available in March from Super Talent resellers worldwide.